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TEI '14: Proceedings of the 8th International Conference on Tangible, Embedded and Embodied Interaction
ACM2014 Proceeding
Publisher:
  • Association for Computing Machinery
  • New York
  • NY
  • United States
Conference:
TEI'14: Eighth International Conference on Tangible, Embedded, and Embodied Interaction Munich Germany February 16 - 19, 2014
ISBN:
978-1-4503-2635-3
Published:
16 February 2014
Sponsors:

Bibliometrics
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Abstract

The work presented at ACM TEI has a strong focus on how computing can bridge atoms, bits and our surrounding everyday environment into cohesive interactive systems. What is surprising is that this focus was considered quite esoteric in 2007, the date of the first TEI conference. This has changed remarkably quickly. Creating such interactive systems has become easier through advances in materials, 3d printing, easy-to-program microcomputers, high-quality sensors and actuators, and specialized toolkits. More importantly, our culture has changed its perspective, where people no longer consider it unusual for computation to be embedded in our environment, surroundings, and everyday objects.

Contributors
  • Ludwig-Maximilians-University Munich
  • University of Calgary
  • Philips Research
  • The University of Sydney
  • Ludwig-Maximilians-University Munich

Recommendations

Acceptance Rates

TEI '14 Paper Acceptance Rate46of172submissions,27%Overall Acceptance Rate393of1,367submissions,29%
YearSubmittedAcceptedRate
TEI '211364029%
TEI '201323728%
TEI '191103633%
TEI '181303728%
TEI '171514127%
TEI '161784525%
TEI '152226328%
TEI '141724627%
TEI '131364835%
Overall1,36739329%